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● Quick-turn prototype pcb assembly
● SMT/SMD assembly
● Thru-hole assembly
● Mixed Technology (SMT/Thru-hole)
● Turn-key assembly
● Consignment assembly
● RoHS compliant lead-free assembly / Non-RoHS assembly
● Conformal coating
● Final box-build and packaging
● Ball brid array (BGA) assembly

Assembly and Test

We have full capability for assembling both SMT/SMD, Through-Hole and mixed technology PCB assemblies. Our surface mount PCB assembly capabilities include BGA, uBGA, 1005 component placements, PoP (Package on Package) and leadless devices assembly. We have accomplished a very challenging PoP (Package on Package) assembly with BGA down to 0.4 mm pitch.

Key Equipments