Package substrate, which is represented by BGA/CSP/TAB/MCM, is a carrier for semi-conductor chip package. IC package substrate works as a transition of electrical connection of different traces between chips and normal printed circuit boards, which are mainly main board, mother board and backplane board. At the same time, it provides chips with heat dissipation tunnel so that the installation size can meet standardization.

1.Rigid Organic Package Substrate
2.Flexible Package Substrate
3.Ceramics Package Substrate