We have more than 130 professional PCB engineers and our services range from IBIS simulation, SPICE simulation, circuit board design, PCB routing, high speed backplane design, ATE PCB design...

Being leading professional PCB desgin company, hampoo has helped many clients as Teradyne, vERIGY, advantest, credence, LTX etc to finish the carrier board and probe board design together with PCB fab...

Standard service, advanced technology and reasonable prices are our advantages. We consistently provide punctual, reliable and value-added high quality service for clients from home and abroad, which makes Hampoo the first option for electronic product development companies.

Package substrate, which is represented by BGA、CSP、TAB、MCM, is a carrier for semi-conductor chip package. IC package substrate works as a transition of electrical connection of different traces between chips and normal printed circuit boards, which are mainly main board, mother board and backplane board. At the same time, it provides chips with heat dissipation tunnel so that the installation size can meet standardization.