Products Introduction
Designed to solve the data exchange system of massive supercomputer; 10GB Infiniband high-speed serial signal transmission; different from the conventional backplane; using orthogonal midplane. Use chip Mellanxo
InfiniScale IV main chip. For High-speed connectors, we are using Amphenol TCS’ Crosssbow high-speed orthogonal connector. Over 2000 pairs of 10Gb high-speed differential signals.

The main chip
InfiniScale IV, Crosssbow

Simulation tools
Hspice

Design parameters
NELECO 16-Layer high-frequency plate

Design Difficulty
The transmission distance of the system is up to 25 inches, and signal attenuation, crosstalk make the whole PCB design very difficult.Simulation needs the optimized models of VIA through, layout and so on, which makes the entire design process extremely difficult, and need to consider the DFM of the PCB. Via simulation and optimization of data is very large. Customer requires system can be successful in the first time.

 Hamp Solutions
(1) Adopt high-speed signal simulation tools to optimize via, lines and other parameters, as well as the system-level whole board simulation;
(2) work closely with PCB p plant to reduce the manufacturing difficulty.