Overview
Top
We have more than 130 professional PCB engineers and our services range from IBIS simulation, SPICE simulation, circuit board design, PCB routing, high speed backplane design, ATE PCB design, schematic symbol library and PCB library to PCB prototyping, small and medium volume production.
Hampoo has rich simulation and PCB design experience especially in high frequency PCB, high speed PCB, PCB signal integrity simulation analysis, A/D Mixed. Besides these, its expertise also involves up to 40 layers board design of PCI、CPCI、PCI- EXPRESS、ATCA、XAUI、SATA&SATAII , DDR&DDRII SDRAM 800M、DDR3 1333M 1666M, TI DSP series, MCU, ARM7 & ARM 9 series, programmable logic, DLP-RAMBUS RLDRAM, switch power supply and high speed backplane. 10Gbps differential signals run up to 30 inches, which was one-time simulation, design and manufacturing success.
Since its establishment in 2003, Hampoo has been focusing on providing PCB turnkey services for clients from multiple market segments such as telecom, industrial, medical, mil/aero, IC ATE, computer server, automotive electronics, portable device and mobile phone board design.
Standard service, advanced technology and reasonable prices are our advantages. We consistently provide punctual, reliable and value-added high quality service for clients from home and abroad, which makes Hampoo the first option for electronic product development companies
Talent Strength
Top
Hampoo Engineers
Professional design and EMS team which coordinate with each other closely

95% engineers have elevtronic engineering Bachelor degrees

Average design experience:above 5 years experience in high speed,high density board design

Assist clients in optimizing designs and providing various suggestions
Design Features
Top
Features Strength
Team-based Concurrent PCB Design
Partitioning Technology
Effective Use of Design Resource
Concurrent & Collaborative Capability
100% Manual Routing
Shorten Design Process
Minimize Layer Count
Saving Cost
Flexbility

Design Flow
Top
Design Field
Top
Hampoo design field includes telecom, industrial, energy, medical, high end instrument, automobile, IC ATE etc. Service Field
Design Strength
Top
Maximum Layer: 40 Maximum Pins: 60000
Maximum Connection: 40000 Minimum Via: 6mil(Laser Drilling 4mil)
Minimum Line Width: 3mil Minimum Line Spacing: 3mil
Maximum BGAs / Board: 44 Minimum BGA Pitch: 0.4mm
High Speed Differential Pairs: 10Gbps runs up to 30 inches Maximum BGA Pins: 2400
Highest CPU Core Frequency: 3.6GHz DDR/DDR2/DDR3/QDR/SRAM memory interface
Switch Power Supply
PCI, CPCI, PCI-X, PCIE, SATA, SATA II, XAUI
ATCA / MicroTCA/AMC, Hyper Transport
TI DLP-RAMBUS RDRAM
DSP Highest Core Frequency: 1.2GHz

 

High Speed/Rules-Driven Designs High Speed Digital Circuit High Density Analog Micro BGA RF Design Micro Vias Backplane
Signal Integrity Analysis/EMC Analysis
DFM/DFT: Valor

 

Typical Cases
Top

ATCA 40GBASE-KRback plane design

CPCIBackplane display
   

MicroTCADesign Show

ATCA
   

FMC Deduction card

Backplane SI
   
 
   
Enquiry & Suggestion

Tel: 086-755-86185500

Email:sales@hampoo.com